Announcing the 17th Annual International Symposium on Semiconductor Manufacturing...
October 27-29, 2008
Hyatt Regency
Tokyo, Japan
ISSM 2008 Details
Not getting ISSM eAnnouncements? Email Us!
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Announcing the 17th Annual International Symposium on Semiconductor Manufacturing...
October 27-29, 2008 Not getting ISSM eAnnouncements? Email Us! |
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ISSM 2008
Important Dates...
Call for Papers: Opens April 2008 Abstract Submission Start: Monday, April 14, 2008 Abstract Submission Due: Monday, June 2, 2008 Notification of Paper Acceptance: Friday, July 18, 2008 Conference: Oct. 27-29, 2008 Conference Sponsors
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ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. This symposium has been held in Japan and in the U.S. on alternate years since 1992. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM’s role has been to challenge the concept of shifting from "know-how" to "science" in semiconductor manufacturing technologies. Past symposia have helped to shape the course of development of "manufacturing science," as well as to create new manufacturing technologies. The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, and Semiconductor Equipment and Materials International (SEMI). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies. ISSM's mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field. |
ISSM 2007 Best Paper Recognition
"A Novel Wafer-Yield PDF Model & Verification With 90-150nm SOC Chips", Hiroo Masuda, Renesas Technology "Eliminating Waste: A Roadmap for Semiconductor Industry Productivity Growth", Eric Englhardt, Applied Materials "300mm Prime Gaps That Need to be Addressed to Boost Productivity", Les Marshall, AMD "Perspectives on Integrated Metrology and Wafer-Level Control", Kevin Lensing, AMD "Advanced Monitoring Method for Copper Interconnect Process", Kensuke Ishikawa, Hitachi "Process Integration for Robust Contact 1 Module of High Density Floating Gate Memory Device", Shengnian Song, Spansion "Ambient Gas Control in Slot-to-Slot Space Inside FOUP to Suppress Cu-Loss After Dual Damascene Patterning", Takao Kamoshima, Renesas Technology "A Statistical Method for the Characterization of Bimodal Electromigration Distributions", Christine Hau-Riege, AMD "A New Fast QC Method for Testing Contact Hole Roughness by Defect Review SEM Image Analysis", Hiroyuki Takeda, Renesas Semiconductor Engineering Corp. To obtain copies of past conference papers or proceedings, contact IEEE Publications at confpubs@ieee.org. |
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